Semiconductor Processing Technicians

Tasks

Core Tasks Include:

• Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles.
• Maintain processing, production, and inspection information and reports.
• Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures.
• Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands.
• Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations.
• Load and unload equipment chambers and transport finished product to storage or to area for further processing.
• Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area.
• Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers.

Supplemental Tasks Include:

• Set, adjust, and readjust computerized or mechanical equipment controls to regulate power level, temperature, vacuum, and rotation speed of furnace, according to crystal growing specifications.
• Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.
• Load semiconductor material into furnace.
• Monitor operation and adjust controls of processing machines and equipment to produce compositions with specific electronic properties, using computer terminals.
• Count, sort, and weigh processed items.
• Calculate etching time based on thickness of material to be removed from wafers or crystals.
• Inspect equipment for leaks, diagnose malfunctions, and request repairs.
• Align photo mask pattern on photoresist layer, expose pattern to ultraviolet light, and develop pattern, using specialized equipment.
• Stamp, etch, or scribe identifying information on finished component according to specifications.
• Scribe or separate wafers into dice.
• Connect reactor to computer, using hand tools and power tools.
• Measure and weigh amounts of crystal growing materials, mix and grind materials, load materials into container, and monitor processing procedures to help identify crystal growing problems.

The data sources for the information displayed here include: O*NET™. (Using onet291)